Invention Grant
- Patent Title: Speaker module
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Application No.: US16236505Application Date: 2018-12-30
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Publication No.: US10602248B2Publication Date: 2020-03-24
- Inventor: Wei Chen
- Applicant: AAC Technologies Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: AAC Technologies Pte. Ltd.
- Current Assignee: AAC Technologies Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: IPro, PLLC
- Agent Na Xu
- Priority: CN201820655641U 20180504
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04R1/28

Abstract:
The present disclosure provides a speaker module, in which at least two leaking holes that communicate with a rear chamber of the housing, and a connecting groove that communicates any two of the at least two leaking holes with each other are arranged at the housing. With such configuration, the processing steps for forming the cone-shaped leaking hole and the air guiding groove are omitted, the processing is significantly simplified compared to the prior art, the processing is much easier and the manufacture efficiency is higher, and an excellent performance in air leakage and pure sounding is guaranteed.
Public/Granted literature
- US20190342644A1 Speaker Module Public/Granted day:2019-11-07
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