Invention Grant
- Patent Title: Mobile terminal and heat dissipation and shielding structure
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Application No.: US15578992Application Date: 2015-06-04
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Publication No.: US10602603B2Publication Date: 2020-03-24
- Inventor: Zhiguo Zhang , Yingchun Zhang , Haitao Zhen , Nanbo Kang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- International Application: PCT/CN2015/080737 WO 20150604
- International Announcement: WO2016/192069 WO 20161208
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K9/00 ; H05K5/02 ; H05K5/00 ; H05K7/20

Abstract:
A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.
Public/Granted literature
- US20180146539A1 Mobile Terminal and Heat Dissipation and Shielding Structure Public/Granted day:2018-05-24
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