Invention Grant
- Patent Title: Circuit board
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Application No.: US16107233Application Date: 2018-08-21
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Publication No.: US10602608B2Publication Date: 2020-03-24
- Inventor: Yuichi Sugiyama , Masashi Miyazaki , Yutaka Hata
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2017-159301 20170822; JP2017-159302 20170822
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L27/146

Abstract:
A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape. The first section of the wiring board is positioned closer to one of the wiring layers than to another of the wiring layers in a vertical direction.
Public/Granted literature
- US20190069397A1 CIRCUIT BOARD Public/Granted day:2019-02-28
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