Invention Grant
- Patent Title: Electronic device
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Application No.: US15560264Application Date: 2016-03-08
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Publication No.: US10602613B2Publication Date: 2020-03-24
- Inventor: Seiki Shimoda , Masaaki Abe
- Applicant: OMRON Corporation
- Applicant Address: JP Kyoto
- Assignee: Omron Corporation
- Current Assignee: Omron Corporation
- Current Assignee Address: JP Kyoto
- Agency: Osha Liang LLP
- Priority: JP2015-081729 20150413
- International Application: PCT/JP2016/057148 WO 20160308
- International Announcement: WO2016/167049 WO 20161020
- Main IPC: H01H9/02
- IPC: H01H9/02 ; H05K1/18 ; H01H50/02 ; H01H50/14 ; H01H50/04 ; H01H1/58 ; H01H51/22

Abstract:
An electronic device where molten solder does not come into contact with a sealant so as not to destroy a sealing function. An electronic device is provided with: an insulating base mounted on a printed circuit board; a common planar terminal provided so as to extend from an outer side surface to a bottom surface edge of the insulating base, and cause electrical continuity between the outer side surface and the bottom surface edge of the insulating base; a cover fitted to the insulating base and covering the common planar terminal; and a sealant sealing a gap between the outer side surface of the insulating base and an inner circumferential surface of the cover. A solder pool is formed in a position surrounded by the printed circuit board and the common planar terminal at the bottom surface edge of the insulating base.
Public/Granted literature
- US20180070449A1 ELECTRONIC DEVICE Public/Granted day:2018-03-08
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