Invention Grant
- Patent Title: Anisotropic conductive connection structure body
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Application No.: US16077785Application Date: 2017-03-27
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Publication No.: US10602619B2Publication Date: 2020-03-24
- Inventor: Daisuke Sato , Akifumi Higuchi
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Paratus Law Group, PLLC
- Priority: JP2016-073087 20160331
- International Application: PCT/JP2017/012408 WO 20170327
- International Announcement: WO2017/170412 WO 20171005
- Main IPC: H05K3/32
- IPC: H05K3/32 ; H05K3/36 ; H01L23/00 ; H01B5/16

Abstract:
An anisotropic conductive connection structure body includes: a first electrode terminal on a surface of which a protruding portion is formed; a second electrode terminal; and an anisotropic conductive adhesive layer containing electrically conductive particles that provide conduction between the first electrode terminal and the second electrode terminal. A ratio of a height of the protruding portion to a before-compression particle size of the electrically conductive particle is less than 60%, an opening area ratio of the first electrode terminal is more than or equal to 55%, and a height of the second electrode terminal is more than or equal to 6 μm.
Public/Granted literature
- US20190053383A1 ANISOTROPIC CONDUCTIVE CONNECTION STRUCTURE BODY Public/Granted day:2019-02-14
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