Invention Grant
- Patent Title: Two-phase fluid-actuated cooling device, system, and method
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Application No.: US15875538Application Date: 2018-01-19
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Publication No.: US10602635B2Publication Date: 2020-03-24
- Inventor: John Ditri , Jay H. Ambrose
- Applicant: Lockheed Martin Corporation
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14

Abstract:
An electronics circuit card system includes a flexible elongated hollow receptacle; a working fluid disposed within the flexible elongated hollow receptacle; one or more wicking structures formed within an interior hollow region of the flexible elongated hollow receptacle, wherein the one or more wicking structures are configured to circulate the working fluid within the flexible elongated hollow receptacle and expand the flexible elongated hollow receptacle against an electronics circuit card; and a chassis configured to hold the flexible elongated hollow receptacle against the electronics circuit card.
Public/Granted literature
- US20190230808A1 TWO-PHASE FLUID-ACTUATED COOLING DEVICE, SYSTEM, AND METHOD Public/Granted day:2019-07-25
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