Invention Grant
- Patent Title: Extension portion of heatsink above a processing component
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Application No.: US16079642Application Date: 2016-04-15
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Publication No.: US10602639B2Publication Date: 2020-03-24
- Inventor: Kai Po Chang , Guo Sheng Mo , Chi Wei Cheng , Ting Shih Chang
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- International Application: PCT/US2016/027759 WO 20160415
- International Announcement: WO2017/180148 WO 20171019
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; H05K7/20 ; G06F1/20

Abstract:
Examples herein disclose a heatsink including an extension portion and a base portion. The extension portion extends above a processing component to a fan, such that the extension prevents a heated air produced by the processing component to combine with cool air from the fan. The base portion, coupled to the extension portion, receives cool air from the fan via the extension portion and transfers heat from a different processing component in a posterior location to the processing component.
Public/Granted literature
- US20190053401A1 EXTENSION PORTION OF HEATSINK ABOVE A PROCESSING COMPONENT Public/Granted day:2019-02-14
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