Invention Grant
- Patent Title: Component mounting apparatus and component mounting system
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Application No.: US15536183Application Date: 2014-12-16
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Publication No.: US10602650B2Publication Date: 2020-03-24
- Inventor: Shigeto Oyama , Satoshi Yoshioka , Hirotaka Hirayama , Satoshi Ushii
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu-shi
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2014/083285 WO 20141216
- International Announcement: WO2016/098184 WO 20160623
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/08

Abstract:
In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being mounted and check necessary components (die components X and Y) that require checking of the mounted states of the other components before being mounted are mounted on a board, the check unnecessary components are mounted first and the mounted state of each component is inspected. When mounting of the check unnecessary components is completed, the check necessary components are mounted after it is checked that the mounted states of the check unnecessary components are normal based on the inspection results.
Public/Granted literature
- US20170354073A1 COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING SYSTEM Public/Granted day:2017-12-07
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