Invention Grant
- Patent Title: Compound, method for manufacturing the compound, and composition for forming organic film
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Application No.: US16013672Application Date: 2018-06-20
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Publication No.: US10604618B2Publication Date: 2020-03-31
- Inventor: Seiichiro Tachibana , Takeru Watanabe , Keisuke Niida , Hiroko Nagai , Takashi Sawamura , Tsutomu Ogihara , Alexander Edward Hess , Gregory Breyta , Daniel Paul Sanders , Rudy J. Wojtecki
- Applicant: SHIN-ETSU CHEMICAL CO., LTD. , INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: JP Tokyo US NY Armonk
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: JP Tokyo US NY Armonk
- Agency: Oliff PLC
- Main IPC: C08F38/00
- IPC: C08F38/00 ; C08G61/02 ; C08K5/00

Abstract:
A compound includes two or more structures shown by the following general formula (1-1) in the molecule, “Ar” represents an aromatic ring or one that contains at least one nitrogen atom and/or sulfur atom optionally having a substituent, and two Ars are optionally bonded with each other to form a ring structure; the broken line represents a bond with Y; Y represents a divalent or trivalent organic group having 6 to 30 carbon atoms that contains an aromatic ring or a heteroaromatic ring optionally having a substituent, the bonds of which are located in a structure of the aromatic ring or the heteroaromatic ring; R represents a hydrogen atom or a monovalent group having 1 to 68 carbon atoms. This compound can be cured even in an inert gas not only in air atmosphere without forming byproducts, and can form an organic under layer film.
Public/Granted literature
- US20190390000A1 COMPOUND, METHOD FOR MANUFACTURING THE COMPOUND, AND COMPOSITION FOR FORMING ORGANIC FILM Public/Granted day:2019-12-26
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