Invention Grant
- Patent Title: Method for producing conductive film, conductive film, and touch panel
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Application No.: US15888486Application Date: 2018-02-05
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Publication No.: US10604671B2Publication Date: 2020-03-31
- Inventor: Kensuke Katagiri , Shin Tajiri
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2015-165166 20150824
- Main IPC: G06F3/041
- IPC: G06F3/041 ; C09D113/02 ; H01B1/22 ; G03C1/04 ; C08K3/08 ; B32B27/18 ; G03F7/40 ; C08J7/04 ; H01B5/14 ; C08J3/24 ; C09D5/24 ; C09D189/06 ; G03F7/06 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G06F3/044 ; H01B13/00 ; H03K17/96 ; C08L39/04 ; C08L33/02

Abstract:
A method for producing a conductive film having a substrate and a conductive layer disposed on the substrate has a first step of forming a precursor layer on the substrate, the precursor layer including a metal component or its precursor, a water-insoluble polymer X having a cross-linking group, a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group, and a water-soluble polymer Z different from polymer X and polymer Y; a second step of reacting the cross-linking group in the water-insoluble polymer X with the reactive group in the water-insoluble polymer Y; and a third step of forming the conductive layer by removing the water-soluble polymer Z.
Public/Granted literature
- US20180155568A1 METHOD FOR PRODUCING CONDUCTIVE FILM, CONDUCTIVE FILM, AND TOUCH PANEL Public/Granted day:2018-06-07
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