To provide a semiconductor package including a protruding part at the bottom surface of a package main body. A semiconductor package including a semiconductor chip is provided, the semiconductor package including: a package main body; a plurality of electrodes exposed at a bottom surface of the package main body; and a protruding part projecting from the bottom surface of the package main body and above the plurality of electrodes, wherein the protruding part is arranged not to overlap two least separated electrodes, among the plurality of electrodes, in a second direction different from a first direction in which the two electrodes are arrayed.