Invention Grant
- Patent Title: Dual-sided radio-frequency package with overmold structure
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Application No.: US15724722Application Date: 2017-10-04
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Publication No.: US10607944B2Publication Date: 2020-03-31
- Inventor: Howard E. Chen , Robert Francis Darveaux
- Applicant: SKYWORKS SOLUTIONS, INC.
- Applicant Address: US MA Woburn
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US MA Woburn
- Agency: Chang & Hale LLP
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/00 ; H01L23/498 ; H01L23/66 ; H05K1/18 ; H01L21/48 ; H01L21/56 ; H01L21/285 ; H01L21/3205 ; H01L21/683 ; H01L21/768 ; H01L21/78 ; H01L25/03 ; H01L23/31 ; H01L25/10 ; H01L25/16 ; H01L25/18 ; H01L23/48 ; H01L25/00
Abstract:
A packaged radio-frequency device is disclosed, including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. A shielded package may be implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit. A set of through-mold connections may be implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate. The device may include a component implemented within the mounting volume and a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.
Public/Granted literature
- US20180096949A1 DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE Public/Granted day:2018-04-05
Information query
IPC分类:
