Invention Grant
- Patent Title: Discharge examination device, wire-bonding apparatus, and discharge examination method
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Application No.: US15238732Application Date: 2016-08-17
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Publication No.: US10607959B2Publication Date: 2020-03-31
- Inventor: Kazumasa Sasakura , Hiroaki Yoshino , Yuki Sekine
- Applicant: SHINKAWA LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINKAWA LTD.
- Current Assignee: SHINKAWA LTD.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP2014-027925 20140217
- Main IPC: H01L23/00
- IPC: H01L23/00 ; G01R19/00 ; G04F10/00

Abstract:
A discharge examination device for examining discharge of a wire-bonding apparatus that applies a voltage between a torch electrode and a wire to procure the discharge therebetween includes a current detection unit, a timer unit and a discharge determination unit. The current detection unit detects a discharge current flowing through the wire. The timer unit measures discharge detection time after application of the voltage before detection of the discharge current. The discharge determination unit determines whether or not the discharge is abnormal based on the discharge detection time. With this, a discharge examination device, a wire-bonding apparatus, and a discharge examination method that are capable of detecting abnormality of discharge are provided.
Public/Granted literature
- US20160358879A1 DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE EXAMINATION METHOD Public/Granted day:2016-12-08
Information query
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