Invention Grant
- Patent Title: Vertical transistor with enhanced drive current
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Application No.: US16057215Application Date: 2018-08-07
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Publication No.: US10608109B2Publication Date: 2020-03-31
- Inventor: Kangguo Cheng , Xin Miao , Alexander Reznicek
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L21/225 ; H01L29/08 ; H01L29/06 ; H01L29/10 ; H01L29/66

Abstract:
A stacked vertical field effect transistor that has enhanced drive current is provided. The stacked vertical field effect transistor includes a lower functional gate structure located adjacent sidewall surfaces of a lower channel portion of a semiconductor channel material pillar. An upper functional gate structure is located above the lower functional gate structure and adjacent sidewall surfaces of an upper channel portion of the semiconductor channel material pillar. A bottom source/drain region is located beneath the lower functional gate structure, a middle source/drain region is located between the lower functional gate structure and the upper functional gate structure, and a top source/drain region is located above the upper functional gate structure.
Public/Granted literature
- US20180342617A1 VERTICAL TRANSISTOR WITH ENHANCED DRIVE CURRENT Public/Granted day:2018-11-29
Information query
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