Invention Grant
- Patent Title: Integrated wiring board assembly
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Application No.: US15642768Application Date: 2017-07-06
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Publication No.: US10609818B2Publication Date: 2020-03-31
- Inventor: Hiroshi Takebayashi
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2016-137472 20160712
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H01L21/683 ; H01L21/67 ; H05K1/11 ; H05K3/36 ; H05K1/02

Abstract:
A connection FPC 75 and a sheet heater 30 are joined together with a solder joint member interposed therebetween. The connection FPC 75 includes a ground contact point 90b and a connection electrode 90d extending along a row of contact points and to which the ground contact point 90b is connected. The connection electrode 90d extends beyond both ends of the row. The sheet heater 30 includes a ground land 46b and a connection land 46d extending along a row of lands and to which the ground land 46b is connected. The connection land 46d extends beyond both ends of the row.
Public/Granted literature
- US20180020544A1 INTEGRATED WIRING BOARD ASSEMBLY Public/Granted day:2018-01-18
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