Invention Grant
- Patent Title: Electromagnetic shielding material
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Application No.: US15917420Application Date: 2018-03-09
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Publication No.: US10609849B2Publication Date: 2020-03-31
- Inventor: Koichiro Tanaka
- Applicant: JX Nippon Mining & Metals Corporation
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Marshall, Gerstein & Borun LLP
- Priority: JP2017-047792 20170313
- Main IPC: B32B7/12
- IPC: B32B7/12 ; H05K9/00 ; B32B15/09 ; B32B15/08 ; B32B15/088 ; B32B15/18 ; B32B15/20 ; B32B27/36 ; B32B27/28 ; B32B27/34 ; B32B37/10 ; B32B37/18 ; C25D3/12 ; C25D3/56 ; C25D3/08 ; B32B37/12 ; B32B37/14 ; B32B38/00 ; B29C43/00 ; B29C43/10 ; B32B7/02 ; B29K705/12 ; B29L31/34 ; B29L31/30 ; B29K79/00 ; B29K77/00 ; B29K67/00 ; B29K105/00 ; B29K705/02 ; B29K705/10

Abstract:
Provided is an electromagnetic wave shielding material including a multilayer structure in which at least one metal foil and at least two resin layers are closely laminated, wherein both surfaces of each metal foil are closely laminated to the resin layers; wherein each metal foil satisfies the following relationship with each of the two resin layers adjacent to the metal foil: 0.02≤VM/VM′≤1.2, in which: VM is a volume fraction of the metal foil relative to a total volume of the metal foil and the resin layer; VM′ is (σR−σR′)/(σM+σR−σR′); σM is a true stress (MPa) of the metal foil at breakage when a tensile stress is applied to the metal foil; σR is a true stress (MPa) of the resin layer at breakage when a tensile stress is applied to the resin layer; and σR′ is a true stress (MPa) of the resin layer when a logarithmic strain same as a logarithmic strain at breakage of the metal foil is applied to the resin layer.
Public/Granted literature
- US20180263145A1 ELECTROMAGNETIC SHIELDING MATERIAL Public/Granted day:2018-09-13
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