Invention Grant
- Patent Title: Housing, electronic device, and method for manufacturing same
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Application No.: US16245451Application Date: 2019-01-11
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Publication No.: US10645830B1Publication Date: 2020-05-05
- Inventor: Kun-Hua Chen , Wei Deng , Ke-Long Wu
- Applicant: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. , FIH (HONG KONG) LIMITED
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.,FIH (HONG KONG) LIMITED
- Current Assignee: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.,FIH (HONG KONG) LIMITED
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: ScienBiziP, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@38651129
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H04M1/02 ; H05K5/00
Abstract:
A housing of plastic strongly bonded to a metal frame is integrally formed as the housing of an electronic device. The metal frame includes at least one plastic grabbing recess to receive portion of a plastic member, an opening of the plastic grabbing recess carries convex teeth, the convex teeth narrow the opening of the plastic grabbing recess, and the convex teeth lock portions of the plastic member.
Public/Granted literature
- US20200170133A1 HOUSING, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SAME Public/Granted day:2020-05-28
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