Invention Grant
- Patent Title: Polyimide precursor composition, method of preparing polyimide precursor composition, and method of preparing polyimide molded article
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Application No.: US15051115Application Date: 2016-02-23
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Publication No.: US10647881B2Publication Date: 2020-05-12
- Inventor: Tomoya Sasaki , Tsuyoshi Miyamoto , Kana Miyazaki , Katsumi Nukada
- Applicant: FUJI XEROX CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJI XEROX CO., LTD.
- Current Assignee: FUJI XEROX CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@36ebd8ec
- Main IPC: C09D179/08
- IPC: C09D179/08 ; B29C41/00 ; B29C41/46 ; B29K79/00 ; B29K105/00

Abstract:
A polyimide precursor composition in which a resin and an organic amine compound are dispersed in an aqueous solvent, wherein the aqueous solvent contains 50% by weight or more of water and at least one organic solvent selected from a solvent group A consisting of a urea solvent, an amide solvent containing an alkoxy group, and an amide solvent containing an ester group in an amount of 5% by weight or more with respect to the total amount of the aqueous solvent, and the resin has a repeating unit represented by the following formula (I): wherein A indicates a tetravalent organic group, and B indicates a bivalent organic group.
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