Invention Grant
- Patent Title: Adhesive composition
-
Application No.: US15748071Application Date: 2016-07-28
-
Publication No.: US10647889B2Publication Date: 2020-05-12
- Inventor: Hayato Miyazaki , Kenji Fukao , Hiroki Uno , Yoshitsugu Goto
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Stein IP, LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@30ccedd3 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@51a5360f
- International Application: PCT/JP2016/072175 WO 20160728
- International Announcement: WO2017/018486 WO 20170202
- Main IPC: C09J4/06
- IPC: C09J4/06 ; C08F2/44 ; C09J109/02 ; C09J11/00 ; C09J157/04 ; C09J133/06 ; C08F279/02 ; C08F290/04 ; C09J5/00

Abstract:
A two-component (meth) acrylic adhesive excellent in peel strength at low temperature and impact resistance is provided. A composition comprising components of (1) to (4): (1) a polymerizable vinyl monomer comprising (1-1) to (1-4); (2) a polymerization initiator; (3) a reducing agent; and (4) an elastomer having no polymerizable unsaturated double bond at the end and having 10 to 30 mol % of a (meth) acrylonitrile. A composition comprising components of (1) to (4): (1) a polymerizable vinyl monomer comprising (1-1) to (1-4); (2) a polymerization initiator; (3) a reducing agent; (4) an elastomer having a polymerizable unsaturated double bond at the end and having 10 to 30 mol % of a (meth) acrylonitrile; and (5) an elastomer having no polymerizable unsaturated double bond at the end.
Public/Granted literature
- US20180215954A1 COMPOSITION Public/Granted day:2018-08-02
Information query
IPC分类: