Invention Grant
- Patent Title: Adhesive and structure, and adhesion method
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Application No.: US15548655Application Date: 2016-02-09
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Publication No.: US10647892B2Publication Date: 2020-05-12
- Inventor: Toshiyuki Takayanagi , Naomoto Ishikawa , Hideki Horizono , Nobuyuki Kamihara , Mikio Muraoka , Hiroaki Hayashi , Osamu Yoshida , Kotaro Tsuji
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD. , AKITA UNIVERSITY , TSUCHIYA CO., LTD.
- Applicant Address: JP Tokyo JP Akita-Shi, Akita JP Nagoya-Shi, Aichi
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.,AKITA UNIVERSITY,TSUCHIYA CO., LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.,AKITA UNIVERSITY,TSUCHIYA CO., LTD.
- Current Assignee Address: JP Tokyo JP Akita-Shi, Akita JP Nagoya-Shi, Aichi
- Agent Manabu Kanesaka; Kenneth Berner; Benjamin Hauptman
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4688350e
- International Application: PCT/JP2016/053872 WO 20160209
- International Announcement: WO2016/129610 WO 20160818
- Main IPC: C09J11/04
- IPC: C09J11/04 ; B29C65/00 ; C09J201/00 ; C08K3/08 ; B32B27/28 ; C09J7/10 ; B32B5/26 ; B29C65/50 ; B32B27/08 ; B29C65/14 ; B29C65/34 ; B29C65/48 ; B32B7/12 ; B29C65/36 ; C09J5/06 ; C08K3/10 ; B29K105/16 ; C08K7/06

Abstract:
Provided is an adhesive that can provide quick bonding between thermoplastic resins and excellent bond strength, a structure having adhesion provided by the adhesive, and an adhesion method using the adhesive. The adhesive bonds a first member (11) containing a thermoplastic resin or a carbon fiber reinforced thermoplastic resin and a second member (12) containing the thermoplastic resin or the carbon fiber reinforced thermoplastic resin. The adhesive includes a thermoplastic resin as a main component containing a metal nano material that absorbs electromagnetic waves and generates heat.
Public/Granted literature
- US20180016473A1 ADHESIVE AND STRUCTURE, AND ADHESION METHOD Public/Granted day:2018-01-18
Information query
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