Invention Grant
- Patent Title: Measuring and analyzing residual stresses and their gradients in materials using high resolution grazing incidence X-ray diffraction
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Application No.: US15822785Application Date: 2017-11-27
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Publication No.: US10648932B2Publication Date: 2020-05-12
- Inventor: Madhana Sunder
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers
- Main IPC: G01N23/207
- IPC: G01N23/207 ; G01N23/20016

Abstract:
A high resolution grazing incidence X-ray diffraction technique for measuring residual stresses and their gradients as a function of depth in thin film materials on substrates or in bulk materials is disclosed. The technique includes positioning a material relative to an X-ray source and an X-ray detector, performing an Omega scan to determine an Omega offset, setting the incidence angle at a first target incidence angle based on the Omega offset and greater than the critical angle of the material, performing a grazing incidence X-ray diffraction scan, analyzing the results to identify diffraction peaks, selecting a diffraction peak, setting the incidence angle at a second target incidence angle based on the Omega offset and a desired penetration depth, performing two theta scanning on a range of two theta values around the selected diffraction peak, performing refraction correction, and determining residual stress values for the material.
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