- Patent Title: Back-end-of-line blocking structures arranged over a waveguide core
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Application No.: US16291671Application Date: 2019-03-04
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Publication No.: US10649140B1Publication Date: 2020-05-12
- Inventor: Yusheng Bian , Ajey Poovannummoottil Jacob , Abu Thomas
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Thompson Hine LLP
- Agent Francois Pagette
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/122 ; G02B6/13 ; H01L23/528 ; H01L23/532 ; H01L23/522 ; H01L21/768 ; H01L21/311 ; H01L21/3105 ; H01L21/02

Abstract:
Structures including a waveguide core and methods of fabricating a structure including a waveguide core. A back-end-of-line interconnect structure includes a cap layer, an interlayer dielectric layer, and one or more metal features embedded in the interlayer dielectric layer. The interlayer dielectric layer is stacked in a vertical direction with the cap layer. The one or more metal features have an overlapping arrangement in a lateral direction with the waveguide core, which is arranged under the back-end-of-line interconnect structure.
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