Invention Grant
- Patent Title: Electronic apparatus, method of producing electronic apparatus, and substrate laminate
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Application No.: US16076834Application Date: 2016-02-16
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Publication No.: US10649262B2Publication Date: 2020-05-12
- Inventor: Koichi Sugiyama , Akihiro Konno , Fei Zeng
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- International Application: PCT/JP2016/000788 WO 20160216
- International Announcement: WO2017/141285 WO 20170824
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; B32B7/12 ; B32B27/08 ; G02F1/1335 ; H01L27/32 ; H01L51/52 ; H01L51/56 ; H05K5/00

Abstract:
[Object] To provide an electronic apparatus that can prevent defects caused by a seepage of ultraviolet curable resin, a method of bonding the electronic apparatus, and a substrate laminate.[Solving Means] An electronic apparatus according to an embodiment of the present technology includes a translucent substrate, a display panel, a first bond layer, and a guard. The translucent substrate has a first surface, a second surface opposite to the first surface, and a frame-shaped coating arranged at a periphery of the first surface. The display panel has a display surface faced to the first surface. The first bond layer bonds the first surface and the display surface together, coats an inner periphery of the coating, and is made of a cured product of light-curable resin. The guard is arranged on the coating along at least a part of a periphery of the first bond layer and has a structural surface with lower wettability to the light-curable resin than that of the coating.[Selected Drawing] FIG. 2
Public/Granted literature
- US20190049769A1 ELECTRONIC APPARATUS, METHOD OF PRODUCING ELECTRONIC APPARATUS, AND SUBSTRATE LAMINATE Public/Granted day:2019-02-14
Information query
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