Invention Grant
- Patent Title: Device comprising compressed thermal interface material (TIM) and electromagnetic (EMI) shield comprising flexible portion
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Application No.: US15637901Application Date: 2017-06-29
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Publication No.: US10649503B2Publication Date: 2020-05-12
- Inventor: Vivek Sahu , Mehdi Saeidi
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loxa, LLP/Qualcomm
- Main IPC: G06F1/18
- IPC: G06F1/18 ; H01L23/40 ; H01L23/13 ; H01L23/14 ; H01L23/373 ; H01L23/433 ; H01L23/552 ; H01L23/00 ; H05K3/36 ; H01L25/065 ; H01L23/42 ; H01L25/10 ; H01L21/56 ; H01L23/367
Abstract:
A device that includes a die, a thermal interface material (TIM) coupled to the die, and an electromagnetic (EMI) shield coupled to the thermal interface material (TIM). The electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM). The electromagnetic (EMI) shield comprises a flexible portion. In some implementations, the thermal interface material (TIM) is compressed by the electromagnetic (EMI) shield such that the thickness of the thermal interface material (TIM) is reduced by about at least 10˜20 percent.
Public/Granted literature
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