Invention Grant
- Patent Title: Conductive substrate and method for fabricating conductive substrate
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Application No.: US15738293Application Date: 2016-06-23
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Publication No.: US10649592B2Publication Date: 2020-05-12
- Inventor: Junichi Nagata
- Applicant: SUMITOMO METAL MINING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO METAL MINING CO., LTD.
- Current Assignee: SUMITOMO METAL MINING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@64dd958e
- International Application: PCT/JP2016/068608 WO 20160623
- International Announcement: WO2016/208654 WO 20161229
- Main IPC: G06F3/044
- IPC: G06F3/044 ; H05K1/02 ; H05K3/06 ; H05K3/16 ; B32B15/08 ; C23C14/14 ; C23F1/02

Abstract:
A laminated substrate is provided that includes a transparent base material, and a laminated body formed at least one surface of the transparent base material. The laminated body includes a blackened layer containing oxygen, copper, and nickel, and a copper layer. A ratio of the nickel is 11 mass % or more and 60 mass % or less, among the copper and the nickel contained in the blackened layer.
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