Invention Grant
- Patent Title: Monolithically integrated system on chip for silicon photonics
-
Application No.: US16529473Application Date: 2019-08-01
-
Publication No.: US10649951B2Publication Date: 2020-05-12
- Inventor: Radhakrishnan L. Nagarajan , Chao Xu
- Applicant: INPHI CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INPHI CORPORATION
- Current Assignee: INPHI CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Ogawa P.C.
- Agent Richard T. Ogawa
- Main IPC: G06F13/24
- IPC: G06F13/24 ; H04B10/80 ; H04B10/40 ; H04B10/556 ; H04B10/54 ; H04B10/516 ; H04B10/69 ; H04B14/02 ; G06F15/78 ; G06F13/42 ; G02B6/12 ; H04L27/00 ; G06F13/364 ; G06F13/40 ; H04L1/00 ; H04L25/03 ; H04L5/14 ; H04L27/02 ; H04L27/18 ; H04L27/34

Abstract:
The present invention includes an integrated system-on-chip device configured on a substrate member. The device has a data input/output interface provided on the substrate member and configured for a predefined data rate and protocol. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The input/output block comprises a SerDes block, a CDR block, a compensation block, and an equalizer block. The SerDes block is configured to convert a first data stream of N having a first predefined data rate at a first clock rate into a second data stream of M having a second predefined data rate at a second clock rate. The device has a driver module provided on the substrate member and coupled to a signal processing block, and a driver interface provided on the substrate member and coupled to the driver module and a silicon photonics device.
Public/Granted literature
- US20190354507A1 MONOLITHICALLY INTEGRATED SYSTEM ON CHIP FOR SILICON PHOTONICS Public/Granted day:2019-11-21
Information query