Invention Grant
- Patent Title: Method for manufacturing an electronic component
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Application No.: US16031638Application Date: 2018-07-10
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Publication No.: US10650955B2Publication Date: 2020-05-12
- Inventor: Hironobu Kubota , Mitsunori Inoue , Tomohiko Mori , Gota Shinohara , Kenji Nishiyama
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7fc8ab3c com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@bd7db6d
- Main IPC: H01F7/06
- IPC: H01F7/06 ; H01F27/255 ; H01F17/00 ; H01F27/02 ; H01F27/23 ; H01F41/04 ; H01G4/12 ; H01F1/26 ; C09K13/04 ; H01F41/02 ; C09K13/00 ; C09K13/06 ; C09K13/08 ; H01F1/03 ; H01F27/28 ; H01F27/29

Abstract:
An electronic component includes a main body composed of an insulator, a coating film covering the main body, a circuit element located inside the main body, and outer electrodes. The insulator contains a metal magnetic powder. The coating film is composed of a resin and a cationic element contained in the insulator.
Public/Granted literature
- US20180323000A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-11-08
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