Invention Grant
- Patent Title: Additive deposition low temperature curable magnetic interconnecting layer for power components integration
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Application No.: US16176630Application Date: 2018-10-31
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Publication No.: US10650957B1Publication Date: 2020-05-12
- Inventor: Yi Yan , Luu Thanh Nguyen , Ashok Prabhu , Anindya Poddar
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Charles A. Brill; Frank D. Cimino
- Main IPC: H01F27/26
- IPC: H01F27/26 ; H01F27/40 ; H01L23/495 ; H01L23/00 ; H01F27/28 ; H01F41/24 ; H01L23/66 ; H01L23/31
Abstract:
Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.
Information query
