Invention Grant
- Patent Title: Multilayer electronic component and board having the same
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Application No.: US15813779Application Date: 2017-11-15
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Publication No.: US10650970B2Publication Date: 2020-05-12
- Inventor: Heung Kil Park , Se Hun Park , Gu Won Ji
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan. Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@78701327
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G2/06 ; H05K3/34 ; H01G4/12

Abstract:
A multilayer electronic component includes: a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed between each pair of first and second internal electrodes, the capacitor body having third and fourth surfaces opposing each other, an end of each the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes disposed on the third and fourth surfaces of the capacitor body, respectively; and first and second connection terminals connected to the first and second external electrodes, respectively, wherein each of the first and second connection terminals includes a vertical portion disposed to face the external electrode, a horizontal portion extended from a lower end of the vertical portion, and a cut portion formed in a portion connecting the vertical portion and the horizontal portion to each other.
Public/Granted literature
- US20190008036A1 MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2019-01-03
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