Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US15388281Application Date: 2016-12-22
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Publication No.: US10651029B2Publication Date: 2020-05-12
- Inventor: Hiroaki Takahashi , Kazunori Fujikawa , Tomonori Kojimaru , Tomomasa Ishida , Ayumi Higuchi , Naozumi Fujiwara , Kana Komori , Shota Iwahata
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@e61aa1f
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/306 ; H01L21/02 ; H01L21/687 ; H01L21/324

Abstract:
The controller is programmed to cause a low-surface-tension liquid supply unit to supply a liquid film of a low-surface-tension liquid to a front surface of a substrate so as to form a liquid film of the low-surface-tension liquid. The controller is programmed to control the substrate rotating unit and the inert gas supply unit so that an inert gas is supplied toward the rotational center position while rotating the substrate, thereby forming an opening spreading from the rotational center position to be formed in the liquid film, and enlarging the opening in a direction away from the rotational center position, and to control the landing-position changing unit to change the landing position of the low-surface-tension liquid to at least two positions except the rotational center position in accordance with enlargement of the opening so that the landing position is placed outside the peripheral edge of the opening.
Public/Granted literature
- US20170186599A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2017-06-29
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