Invention Grant
- Patent Title: Tantalum compound
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Application No.: US16183927Application Date: 2018-11-08
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Publication No.: US10651031B2Publication Date: 2020-05-12
- Inventor: Seung-min Ryu , Takanori Koide , Naoki Yamada , Jae-soon Lim , Tsubasa Shiratori , Youn-joung Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-do JP Tokyo
- Assignee: Samsung Electronics Co., Ltd.,Adeka Corporation
- Current Assignee: Samsung Electronics Co., Ltd.,Adeka Corporation
- Current Assignee Address: KR Suwon-Si, Gyeonggi-do JP Tokyo
- Agency: Lee IP Law, PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@19bdb817
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L21/44 ; H01L21/02 ; H01L49/02 ; H01L21/768 ; H01L21/285 ; H01L29/66 ; H01L29/78 ; H01L21/8238
Abstract:
A tantalum compound, a method of forming a thin film, and a method of fabricating an integrated circuit device, the tantalum compound being represented by the following General Formula (I):
Public/Granted literature
- US20190074175A1 TANTALUM COMPOUND Public/Granted day:2019-03-07
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