Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US16018511Application Date: 2018-06-26
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Publication No.: US10651058B2Publication Date: 2020-05-12
- Inventor: Hitoshi Nakai , Yasunori Kanematsu
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@17c255dc
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H01L21/02 ; H01L21/683
Abstract:
A substrate processing method includes a substrate holding step of horizontally holding a substrate having a first major surface and a second major surface at an opposite side of the first major surface, a coating film forming step of supplying a coating agent to the first major surface to form a sublimating coating film which covers the first major surface, and a coating film cleaning step of cleaning a front surface of the coating film.
Public/Granted literature
- US20190035650A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2019-01-31
Information query
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