- Patent Title: Wafer composite and method for producing semiconductor components
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Application No.: US16264265Application Date: 2019-01-31
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Publication No.: US10651072B2Publication Date: 2020-05-12
- Inventor: Rudolf Berger , Wolfgang Lehnert , Gerhard Metzger-Brueckl , Guenther Ruhl , Roland Rupp
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7056bfe7
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/02 ; H01L21/78 ; H01L29/66 ; H01L29/78

Abstract:
This application relates to a method for producing a semiconductor component, in which a wafer composite is provided. The wafer composite includes a donor substrate, an auxiliary substrate and a separation layer arranged between the auxiliary substrate and the donor substrate. The separation layer has a support structure and sacrificial material, which is formed laterally between elements of the support structure. The auxiliary substrate is separated from the donor substrate. The separation includes a selective removal of the sacrificial material in relation to the support structure.
Public/Granted literature
- US20190244850A1 Wafer Composite and Method for Producing Semiconductor Components Public/Granted day:2019-08-08
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