Invention Grant
- Patent Title: Microelectronic devices comprising manganese-containing conductive structures, and related electronic systems and methods
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Application No.: US16515265Application Date: 2019-07-18
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Publication No.: US10651084B1Publication Date: 2020-05-12
- Inventor: Kentaro Ishii
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/532
Abstract:
A microelectronic device comprises a first conductive material comprising copper, a conductive plug comprising tungsten in electrical communication with the first conductive material, and manganese particles dispersed along an interface between the first conductive material and the conductive plug. Related electronic systems and related methods are also disclosed.
Information query
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