Invention Grant
- Patent Title: Polishing with measurement prior to deposition of outer layer
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Application No.: US15173584Application Date: 2016-06-03
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Publication No.: US10651098B2Publication Date: 2020-05-12
- Inventor: Tomohiko Kitajima , Jeffrey Drue David , Jun Qian , Taketo Sekine , Garlen C. Leung , Sidney P. Huey
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B49/10
- IPC: B24B49/10 ; H01L21/66 ; H01L21/67 ; B24B37/013 ; H01L21/321 ; H01L21/3105
Abstract:
A method of controlling polishing includes storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of an outer layer over the at least one layer, after deposition of the outer layer over the at least one layer and during polishing of the outer layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.
Public/Granted literature
- US20160284615A1 POLISHING WITH MEASUREMENT PRIOR TO DEPOSITION OF OUTER LAYER Public/Granted day:2016-09-29
Information query
