Invention Grant
- Patent Title: Non-destructive testing of integrated circuit chips
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Application No.: US15813547Application Date: 2017-11-15
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Publication No.: US10651099B2Publication Date: 2020-05-12
- Inventor: David W. Abraham , John M. Cotte
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/00 ; G01R31/28 ; H01L21/02 ; H01L21/67 ; G01R1/04 ; G01R31/317
Abstract:
Semiconductor devices and electronics packaging methods include integrated circuit chips having redundant signal bond pads along with signal bond pads connected to the same signal port for non-destructive testing of the integrated circuit chips prior to packaging. Electrical testing is made via the redundant signal bond after which qualified integrated circuit chips can be attached to a pristine and bumped final interposer or printed circuit board to provide increased reliability to the assembled electronic package.
Public/Granted literature
- US20190013252A1 NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS Public/Granted day:2019-01-10
Information query
IPC分类:
