Invention Grant
- Patent Title: Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structure
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Application No.: US16097050Application Date: 2017-04-28
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Publication No.: US10651143B2Publication Date: 2020-05-12
- Inventor: Tomotoshi Satoh , Hiroya Sato , Katsuaki Suganuma , Aiji Suetake , Shijo Nagao , Jinting Jiu , Seiichiro Kihara
- Applicant: SHARP KABUSHIKI KAISHA , OSAKA UNIVERSITY
- Applicant Address: JP Sakai, Osaka JP Suita-shi, Osaka
- Assignee: SHARP KABUSHIKI KAISHA,OSAKA UNIVERSITY
- Current Assignee: SHARP KABUSHIKI KAISHA,OSAKA UNIVERSITY
- Current Assignee Address: JP Sakai, Osaka JP Suita-shi, Osaka
- Agency: ScienBiziP, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2d2581b9
- International Application: PCT/JP2017/017032 WO 20170428
- International Announcement: WO2017/188446 WO 20171102
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H05K3/32 ; H01B1/02 ; B22F1/00 ; H01B1/22 ; B22F7/06 ; B22F5/00

Abstract:
Provided is an electrode like a protruding electrode that is self-standing on a substrate. A conductive paste (202) contains a conductive powder, an alcoholic liquid component, and no adhesives. The conductive powder contains conductive particles having a thickness of 0.05 μm or more and 0.1 μm or less and a representative length of 5 μm or more and 10 μm or less, the representative length being a maximum diameter in a plane perpendicular to the direction of the thickness. The weight percentage of the alcoholic liquid component relative to the conductive paste is 8% or more and 20% or less.
Public/Granted literature
- US20190157229A1 CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CONNECTION STRUCTURE PRODUCTION METHOD Public/Granted day:2019-05-23
Information query
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