Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US16111788Application Date: 2018-08-24
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Publication No.: US10651318B2Publication Date: 2020-05-12
- Inventor: Tatsuo Shimizu
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@119dc4d
- Main IPC: H01L29/872
- IPC: H01L29/872 ; H01L29/16 ; H01L29/36 ; H01L29/66 ; H01L21/04

Abstract:
A semiconductor device according to an embodiment includes a first electrode; a second electrode; a silicon carbide layer disposed between the first electrode and the second electrode; a first n-type silicon carbide region disposed in the silicon carbide layer; and a first nitrogen region disposed in the silicon carbide layer, the first nitrogen region disposed between the first n-type silicon carbide region and the first electrode, and the first nitrogen region having a first nitrogen concentration higher than a first n-type impurity concentration of the first n-type silicon carbide region.
Public/Granted literature
- US20190296156A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-09-26
Information query
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