Invention Grant
- Patent Title: Memory devices and methods of forming the same
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Application No.: US16260215Application Date: 2019-01-29
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Publication No.: US10651380B1Publication Date: 2020-05-12
- Inventor: Curtis Chun-I Hsieh , Wei-Hui Hsu , Wanbing Yi , Yi Jiang , Juan Boon Tan
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Viering Jentschura & Partner MBB
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
In a non-limiting embodiment, a device may be formed having a substrate that has at least a first region. A base dielectric layer is arranged over the substrate. The base dielectric layer includes an interconnect in the first region. A first electrode is arranged over the interconnect in the first region. A mask structure is arranged over the first electrode. At least one spacer stack is arranged at least partially around the mask structure and the first electrode. The spacer stack(s) includes a resistive switching element at least partially lining sidewalls of the mask structure and the first electrode, and a second electrode arranged over the resistive switching element.
Information query
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