Invention Grant
- Patent Title: Radio-frequency module with switch IC having a ground electrode for isolating between a common terminal and selection terminals
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Application No.: US15229285Application Date: 2016-08-05
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Publication No.: US10651884B2Publication Date: 2020-05-12
- Inventor: Masashi Hayakawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@55f1931e
- Main IPC: H04B1/44
- IPC: H04B1/44 ; H03K17/693
Abstract:
A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.
Public/Granted literature
- US20170047963A1 RADIO-FREQUENCY MODULE Public/Granted day:2017-02-16
Information query
