Invention Grant
- Patent Title: In-layer Signal processing
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Application No.: US15890976Application Date: 2018-02-07
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Publication No.: US10652529B2Publication Date: 2020-05-12
- Inventor: Mark A. Lamkin , Kyle Martin Ringgenberg , Jordan David Lamkin
- Applicant: Lockheed Martin Corporation
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: Baker Botts L.L.P.
- Main IPC: H04N13/00
- IPC: H04N13/00 ; H04N13/388 ; G06T7/557 ; H01L25/16 ; H05K1/18 ; H05K1/02

Abstract:
In one embodiment, an electronic display assembly includes a sensor array located on one side of a circuit board, an electronic display array located on an opposite side of the circuit board from the sensor array, and a logic unit layer coupled to one side of the circuit board. The logic unit layer is configured to receive first signals from the sensor array, perform at least one operation on the received first signals to create second signals, and transmit the second signals to the electronic display array. The first signals are communicated using a particular signal protocol and correspond to light captured by sensor pixels of the sensor array. The second signals are communicated using the particular signal protocol of the first signals and are operable to instruct the electronic display array to display light corresponding to the light captured by the plurality of sensor pixels.
Public/Granted literature
- US20190246100A1 In-Layer Signal Processing Public/Granted day:2019-08-08
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