Invention Grant
- Patent Title: Electronic module and method for producing an electronic module
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Application No.: US16481281Application Date: 2018-01-23
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Publication No.: US10653020B2Publication Date: 2020-05-12
- Inventor: Uwe Liskow
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Maginot, Moore & Beck LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3f2b92a2
- International Application: PCT/EP2018/051571 WO 20180123
- International Announcement: WO2018/153595 WO 20180830
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K5/00 ; H05K7/12 ; H05K3/34 ; H05K1/11

Abstract:
An electronic module includes a printed circuit board (PCB) element, a base with a first electrically conductive contact element, and an electronic component with a second electrically conductive contact element. The base is fastened on and electrically connected to the PCB element. The electronic component is electrically connected to the base by an electric contact region between the first and second contact elements. A first portion of the first contact element protrudes from the base on a first side of the base facing away from the PCB element. The first portion of the first contact element and/or a second portion of the second contact element has a resilient configuration such that the electronic component is mechanically fastened to the base by a spring force between the first and second contact elements. The electronic module in one embodiment is configured for a transmission controller or an electric vehicle.
Public/Granted literature
- US20200045839A1 Electronic Module and Method for Producing an Electronic Module Public/Granted day:2020-02-06
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