Invention Grant
- Patent Title: Epoxy resin composition
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Application No.: US15560773Application Date: 2016-03-22
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Publication No.: US10655005B2Publication Date: 2020-05-19
- Inventor: Takeshi Endo , Kozo Matsumoto , Ken-ichi Tamaso , Chihiro Asakura , Ryo Ogawa
- Applicant: ADEKA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ADEKA CORPORATION
- Current Assignee: ADEKA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Millen, White, Zelano & Branigan, PC
- Agent Ryan Pool
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@49befc28
- International Application: PCT/JP2016/058944 WO 20160322
- International Announcement: WO2016/152839 WO 20160929
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08J5/24 ; C08K5/5399 ; C08K5/00

Abstract:
An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a phosphorous-containing compound (C) indicated by the following general formula (1) and also, if necessary, a flame retardant (D), and a laminated plate comprising said resin composition; wherein m indicates an integer from 2 to 10, R1 to R4 each independently indicate a hydrogen atom, an alkyl group or an aryl group, R5 indicates a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X indicates an oxygen atom or a sulfur atom, Y indicates an oxygen atom, a sulfur atom or —NR6—, and R6 indicates a hydrogen atom, an alkyl group or an aryl group.
Public/Granted literature
- US20180051167A1 EPOXY RESIN COMPOSITION Public/Granted day:2018-02-22
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