Invention Grant
- Patent Title: Monitoring method and monitoring apparatus of thimble bases
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Application No.: US15744716Application Date: 2017-11-30
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Publication No.: US10656099B2Publication Date: 2020-05-19
- Inventor: Ping Chen
- Applicant: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Applicant Address: CN Wuhan
- Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Wuhan
- Agency: Hemisphere Law, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6e7a6d79
- International Application: PCT/CN2017/114006 WO 20171130
- International Announcement: WO2019/104661 WO 20190606
- Main IPC: G01N21/956
- IPC: G01N21/956 ; G02F1/13 ; G01N21/95

Abstract:
A monitoring method of a thimble base includes the following steps: arranging a reflective surface on a thimble head of a thimble base; arranging at least a light source and a receiver on the thimble base; establishing a reflection path between the thimble bases to project light onto the reflective surface of the thimble head of one of the thimble bases in the reflection path, so that light is reflected between the reflective surfaces and is finally reflected to the receiver. The disclosure also provides a monitoring apparatus of the thimble bases. The monitoring apparatus includes a carrying platform, thimble bases arranged in an array on the carrying platform, and at least one light projecting and receiving device. Compared with the prior art, the disclosure realizes real-time monitoring of the thimble bases, thereby avoiding the problem of fragmentation caused by deformation of the thimble bases.
Public/Granted literature
- US20190162677A1 MONITORING METHOD AND MONITORING APPARATUS OF THIMBLE BASES Public/Granted day:2019-05-30
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