Invention Grant
- Patent Title: Solid-state imaging device, method of manufacturing the same, and electronic device
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Application No.: US15554306Application Date: 2016-02-25
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Publication No.: US10656315B2Publication Date: 2020-05-19
- Inventor: Atsushi Toda
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4aac2e88
- International Application: PCT/JP2016/055568 WO 20160225
- International Announcement: WO2016/143532 WO 20160915
- Main IPC: G02B5/28
- IPC: G02B5/28 ; H04N9/07 ; H01L27/14 ; H01L31/02 ; H01L51/42 ; H01L31/101 ; H01L27/146 ; H04N5/378 ; H04N9/04 ; H01L27/30

Abstract:
The present technology relates to a solid-state imaging device, a method of manufacturing the same, and an electronic device capable of improving sensitivity in a certain wavelength band and at the same time reducing color mixture of light of other wavelength bands in a photoelectric conversion unit. The solid-state imaging device is provided with a first photoelectric conversion unit which generates a signal charge corresponding to a light amount of light of a first color component on a short wavelength side out of incident light, a second photoelectric conversion unit which generates a signal charge corresponding to a light amount of light of a second color component on a long wavelength side out of the incident light, and a first optical interference film provided between the first photoelectric conversion unit and the second photoelectric conversion unit formed below the first photoelectric conversion unit which transmits the light on the long wavelength side while reflecting the light on the short wavelength side out of the incident light. The present technology may be applied to a CMOS image sensor, for example.
Public/Granted literature
- US20180081099A1 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE Public/Granted day:2018-03-22
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