Invention Grant
- Patent Title: Laminated printed circuit board with over-molded light guide
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Application No.: US15852433Application Date: 2017-12-22
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Publication No.: US10656317B2Publication Date: 2020-05-19
- Inventor: Ron G. Gipson , Bhanumurthy Veeragandham
- Applicant: Dura Operating, LLC
- Applicant Address: US MI Auburn Hills
- Assignee: DURA OPERATING, LLC
- Current Assignee: DURA OPERATING, LLC
- Current Assignee Address: US MI Auburn Hills
- Agency: Vivacqua Crane, PLLC
- Main IPC: F21V8/00
- IPC: F21V8/00 ; H05K1/03 ; H05K3/28 ; G02F1/13357 ; G06F3/041

Abstract:
A laminated printed circuit board with over-molded light guide includes a printed circuit board having electronic components mounted on a first face of the printed circuit board, and a bore extending through the printed circuit board. A light emitting diode is mounted on the first face proximate to the bore. An opaque film is fixed onto a second face of the printed circuit board, the opaque film creating an end wall of the bore. A light transmissive polymeric material is applied over each of the electronic components, the light emitting diode and a portion of the first face of the printed circuit board. A portion of the polymeric material extends into the bore and contacts the opaque film defining the end wall of the bore to create a light guide for transmitting light from the light emitting diode through the bore.
Public/Granted literature
- US20190196085A1 LAMINATED PRINTED CIRCUIT BOARD WITH OVER-MOLDED LIGHT GUIDE Public/Granted day:2019-06-27
Information query