A molded component assembly includes a printed circuit board with a first face and an oppositely facing second face. Multiple light emitting diodes are mounted on a first portion of the first face. Multiple electronics components are mounted on a second portion of the first face. A light guide of a light translucent polymeric material has a contact surface, multiple light outlets, and multiple light emitting diode receiving pockets defining recesses in the contact surface, each sized to receive one of the light emitting diodes when the contact surface directly contacts the first portion of the first face, with visible light from the light emitting diodes transmitted through the light guide to the light outlets. A first polymeric material is molded over a portion of the second portion of the first face encapsulating the electronics components and contacting a portion of the light guide.