- Patent Title: Curved touch module structure and method for laminating the same
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Application No.: US16002390Application Date: 2018-06-07
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Publication No.: US10656736B2Publication Date: 2020-05-19
- Inventor: Po Ching Lin
- Applicant: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
- Applicant Address: CN Chengdu, Sichuan CN Shenzhen, Guangdong TW Zhunan Township, Miaoli County
- Assignee: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.,INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD.,GENERAL INTERFACE SOLUTION LIMITED
- Current Assignee: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.,INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD.,GENERAL INTERFACE SOLUTION LIMITED
- Current Assignee Address: CN Chengdu, Sichuan CN Shenzhen, Guangdong TW Zhunan Township, Miaoli County
- Agency: Rosenberg, Klein & Lee
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1ea37e94
- Main IPC: G06F3/041
- IPC: G06F3/041 ; B32B7/12 ; B32B37/06 ; B32B37/12

Abstract:
A curved touch module structure and a method for laminating the same, which are the theremoplastic technologies, are used to solve the problem with wrinkles at stress-accumulated positions easily caused by a laminated material during a process of laminating a curved surface. The internal curved surface of an appearance-protecting layer has a planar structure whose position corresponds to the bonding area of a touch element layer. When the touch element layer is theremoplastically laminated to the curved surface of the appearance-protecting layer, the first bonding pads of the bonding area are formed on the planar structure. As a result, when a rear-end process for hot pressing and bonding is performed, a bonding platform needs to be designed according to the shape and curvature of products without modifying the other existing elements, thereby increasing the fabrication yield and reducing the production cost.
Public/Granted literature
- US20190317618A1 CURVED TOUCH MODULE STRUCTURE AND METHOD FOR LAMINATING THE SAME Public/Granted day:2019-10-17
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