Invention Grant
- Patent Title: Thin film component sheet, board with built-in electronic component, and method of manufacturing the thin film component sheet
-
Application No.: US15467685Application Date: 2017-03-23
-
Publication No.: US10658200B2Publication Date: 2020-05-19
- Inventor: Hitoshi Saita
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2339f647
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/48 ; H01L23/498 ; H01G4/33 ; H01L23/00 ; H05K3/46 ; H05K3/42 ; H05K1/16
Abstract:
A thin film component sheet includes: a conducting interconnection layer formed of a conductor; an insulating layer that is laminated on the conducting interconnection layer and is formed of an insulating material; and a plurality of thin film electronic components, each of which has a pair of first and second electrode layers and a dielectric layer provided between the first and second electrode layers, and which are arranged to be separated on the insulating layer. In a state in which a main surface of the first electrode layer in each of the plurality of thin film electronic components is exposed to an outside on a main surface of one side of the thin film component sheet, a flat surface of the main surface of the thin film component sheet is formed.
Public/Granted literature
Information query
IPC分类:
