Invention Grant
- Patent Title: Polyimide composition for package structure, package structure and method of fabricating the same
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Application No.: US15877371Application Date: 2018-01-22
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Publication No.: US10658208B2Publication Date: 2020-05-19
- Inventor: Sih-Hao Liao , Hung-Jui Kuo , Yu-Hsiang Hu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L21/67
- IPC: H01L21/67 ; C08L79/08 ; C08G73/10 ; C08K5/5419 ; G01R33/46 ; G01N30/72 ; C08K5/5455
Abstract:
A polyimide composition for a package structure is provided. The polyimide composition includes a polyimide precursor, a cross-linker, a photosensitizer, a first additive, a second additive and a solvent. The first additive comprises a polyether based compound, and the second additive comprises a siloxane based compound. The polyimide composition has more than 98% cyclization of the polyimide precursor when the polyimide composition is cured at a temperature range of 160° C. to 200° C.
Public/Granted literature
- US20190157121A1 POLYIMIDE COMPOSITION FOR PACKAGE STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2019-05-23
Information query
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